By DayakDaily Team
KUCHING, April 22: Sarawak Microelectronics Design (SMD) is set to sign a memorandum of understanding (MOU) with CSA Catapult, a company based in the United Kingdom (UK), at the Artificial Intelligence (AI) and Semiconductor Summit, which will be held at the UK Parliament Building on April 23.
According to a news report from TV Sarawak (TVS) today, the MOU aims to improve the capabilities and applications of semiconductor compounds made of two or more elements compared to silicon made of one element.
It said the MOU ceremony will be witnessed by the Premier of Sarawak, Datuk Patinggi Tan Sri Abang Johari Tun Openg.
On the same note, SMD is also reported to collaborate with a Belgian company to increase the capacity of semiconductor chip design services with an investment of 70 million Euros.
Previously, SMD signed an MOU involving a strategic collaboration with companies from the UK, namely Riverbeck and Big Innovation Centre, to develop technology that enables semiconductor chips to be manufactured in a cleaner and more sustainable manner.
In collaboration with Riverbeck, SMD will play a role in helping develop radio frequency chips for the aerospace industry, which are used by foreign companies such as British Aerospace. — DayakDaily
