By Karen Bong
KUCHING, Feb 1: SMD Semiconductor has partnered with Riverbeck Ltd UK, a highly specialised radio frequency chip design company based in London, to co-develop an advanced Radio Frequency Integrated Circuit (RFIC) or microchip tailored for satellite applications.
The Memorandum of Understanding (MOU) formalising this collaboration was exchanged today between SMD Semiconductor represented by its chief executive officer Shariman Jamil and Riverbeck by its sales director Kelvin Hudson.
The MOU exchange, which took place during the closing ceremony of the “Train-The-Trainers: Talent Development in Semiconductors and Chip Design” programme at Borneo Cultures Museum’s auditorium, was witnessed by Minister of Education, Innovation and Talent Development Dato Sri Roland Sagah Wee Inn and British High Commissioner to Malaysia Her Excellency Ailsa Terry.
Shariman emphasised that this technological advancement is strategically aimed at meeting the demands of the global aerospace market, emphasising the companies’ dedication to pushing the boundaries of innovation in space technology.
“I am delighted that our potential partner, Turkish Aerospace (TUSAS), is here with us today. I appreciate your support, TUSAS. Moving forward, we will also engage with British Aerospace to explore partnership in the application of this new radio frequency chip further,” he said.
In addition to the collaboration with Riverbeck, SMD Semiconductor also exchanged an MOU with Big Innovation Centre, a UK think tank in artificial intelligence, big data, and sustainability based in London, which was represented by its chief executive officer Professor Birgette Anderson.
The MOU outlines a collaboration between SMD and Big Innovation Centre UK to develop a framework for “Pioneering Hollistic Sustainability Approach and Circular Economy Strategy for Semiconductors” in Sarawak.
Expressing gratitude to all stakeholders involved, Shariman was confident that their endeavours in talent development will continue to thrive and contribute significantly to the semiconductor and Integrated Chip (IC) design landscape.
Meanwhile, Sagah who is also SMD Semiconductor chairman, emphasised the importance of these MOUs in sparking innovation and fostering a collaborative spirit.
He sees these partnerships will pave the way for the creation of groundbreaking ideas and products.
“It’s not just about this partnership; it’s like building a connection between countries, showing how well we can work together in advanced technology.
“I am confident that together, we will continue to reach new heights in the dynamic and exciting field of chip design,” he added.
Deputy Minister of Education, Innovation and Talent Development Datuk Francis Harden Hollis, State Financial Secretary Dato Sri Dr Wan Lizozman Wan Omar, and MEITD permanent secretaty Datu Azmi Bujang were among those present. — DayakDaily
